The Bluetooth and WiFi chips are from Ti (BRF6300 and WL125, respectively).
The power management unit is a Qualcomm PM7500
NAND+DRAM are in a multi-chip module (1.8V, 2GBit NAND x8, 1GBbit DRAM x32) from Samsung
The 3G/GSM RF part consists of Qualcomm's RFR6500 (receive with integrated GPS) and RTR6275 (transmit) as well as AWT6280, AWT6273 and AWT6273 amplifiers
There furthermore is a CPLD: Xilinx XC2C128 (3000 system gates, 128 macrocells).
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